Antenna using through-silicon via

ABSTRACT

An antenna includes a substrate and a top plate disposed over the substrate. At least one feed line is connected to the top plate, and each feed line comprises a first through-silicon via (TSV) structure passing through the substrate. At least one ground line is connected to the top plate, and each ground line comprises a second TSV structure passing through the substrate. The top plate is electrically conductive, and the at least one feed line is arranged to carry a radio frequency signal. The at least one ground line is arranged to be coupled to a ground.

TECHNICAL FIELD

The present disclosure relates generally to an integrated circuit and,more particularly, to an antenna.

BACKGROUND

A conventional on-chip Planar Inverted F Antenna (PIFA) occupies arelatively large area compared to other parts of integrated circuits,e.g., for applications in the frequency range from 1 GHz to 30 GHz. Theon-chip antenna has performance issues compared to Printed Circuit Board(PCB) antennas. For some on-chip antennas, a substrate functions as aninitial ground, and with a high dielectric constant ∈_(r), tends to trapmicrowave signals. They could be used for transmission from die to dieor die to PCB, or die to free space, to take place of either bond-wire,interconnects between die-to-die or die to PCB, or an antenna to freespace itself.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference is now made to the following descriptions taken in conjunctionwith the accompanying drawings, in which:

FIG. 1A is a schematic diagram showing a three-dimensional view of anexemplary Planar Inverted F Antenna (PIFA) according to someembodiments;

FIG. 1B is a schematic diagram showing a cross-sectional side view ofthe exemplary PIFA in FIG. 1A according to some embodiments;

FIG. 2 is a plot showing a return loss performance of the exemplary PIFAin FIG. 1A according to some embodiments;

FIG. 3A-FIG. 3D are schematic diagrams showing top views of differentimplementations of the exemplary PIFA in FIG. 1A according to someembodiments;

FIG. 4 is a schematic diagram showing a three-dimensional view ofvarious exemplary implementations of the exemplary PIFA in FIG. 1Aaccording to some embodiments;

FIG. 5 is a plot showing a return loss performance of the exemplary PIFAin FIG. 4 according to some embodiments;

FIG. 6 is a schematic diagram showing a three-dimensional view of yetanother implementation of the exemplary PIFA in FIG. 1A according tosome embodiments;

FIG. 7 is a flowchart of designing the exemplary PIFA in FIG. 1Aaccording to some embodiments; and

FIG. 8 is a flowchart of implementing the exemplary PIFA in FIG. 1Aaccording to some embodiments.

DETAILED DESCRIPTION

The making and using of various embodiments are discussed in detailbelow. It should be appreciated, however, that the present disclosureprovides many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific embodiments discussedare merely illustrative of specific ways to make and use, and do notlimit the scope of the disclosure.

FIG. 1A is a schematic diagram showing a three-dimensional view of anexemplary Planar Inverted F Antenna (PIFA) according to someembodiments. The PIFA 100 includes a top plate 102 formed over asubstrate 104. The top plate 102 is electrically conductive. In oneexample, the substrate 104 is a semiconductor wafer. In another example,the substrate 104 includes a semiconductor chip. In at least oneembodiment, the substrate 104 includes silicon. In some otherembodiments, the substrate 104 may alternatively or additionally includeother elementary semiconductor, such as germanium. The substrate 104 mayalso include a compound semiconductor, such as silicon carbide, galliumarsenide, indium arsenide, indium phosphide, or any other suitablematerial.

The substrate 104 may include an epitaxial layer. For example, thesubstrate 104 may have an epitaxial layer overlying a bulksemiconductor. Further, the substrate 104 may be strained forperformance enhancement. For example, the epitaxial layer may includesemiconductor materials different from those of the bulk semiconductorsuch as a layer of silicon germanium overlying bulk silicon, or a layerof silicon overlying a bulk silicon germanium formed by a processincluding selective epitaxial growth (SEG). Furthermore, the substrate104 may include a semiconductor-on-insulator (SOI) structure. In variousexamples, the substrate 104 includes a buried oxide (BOX) layer formedby a process such as separation by implanted oxygen (SIMOX).

In some embodiments, the substrate 104 can include various doped wellsand other doped features configured and coupled to form variousmicroelectronic devices such as metal-insulator-semiconductor fieldeffect transistors (MOSFET) including complementary MOSFET (CMOS),imaging sensor including CMOS imaging sensors (CIS),micro-electro-mechanical systems (MEMS), and/or other suitable activeand/or passive devices. The doped wells and other doped features includep-type doped region and/or an n-type doped region, formed by a dopingprocess such as ion implantation.

Other structures such as gate dielectric and polysilicon gate electrodesmay be additionally formed on the substrate 104 for devices such asMOSFET devices. The substrate 104 also includes various isolationfeatures configured to separate various devices from each other forproper isolation. The isolation features may include differentstructures and can be formed by certain particular processingtechnologies. In one example, the isolation features include dielectricisolation such as shallow trench isolation (STI). The STI can befabricated by etching the substrate to form a trench and filling thetrench with a dielectric material.

A ground plate 106 is formed below the substrate 104. The ground plate106 is electrically conductive. A feed line 108 using a through-siliconvia (TSV) carries (couples) a radio frequency (RF) signal to/from thetop plate 102 at a feed point (where the feed line 108 is connected tothe top plate 102). The RF signal can be transmitted by an RFtransmitter and/or received by an RF receiver. A TSV is a verticalelectrical connection passing through a (silicon) wafer or die, e.g.,the substrate 104. TSV technology is important in creating 3-dimensional(3D) packages and 3D integrated circuits. A 3D package, e.g. system inpackage, chip-stack multi-chip module (MCM), etc., contains two or morechips (integrated circuits) stacked vertically so that they occupy lessspace.

In edge-wired 3D packages, the stacked chips are wired together alongtheir edges; this edge wiring slightly increases the length and width ofthe package and usually requires an extra interposer layer between thechips. In TSV 3D packages, the TSV replaces edge wiring by creatingvertical connections through the body of the chips, providing a morecompact package. In addition, critical electrical paths through thedevice can be shortened, leading to faster operation.

A ground line 110 using a TSV couples electrical ground to the top plate102 at a ground point (where the feed line 110 is connected to the topplate 102). In one implementation, the top plate 102 has an area of 530μm×530 μm. The position (x, y) of the feed point is at (150 μm, 100 μm),and the ground point is at (200 μm, 150 μm). The length of TSV maydepend on the thickness of the substrate 104, and can be about 100 μm insome embodiments. The TSV inner radius may be 6 μm-12 μm, and the TSVouter radius may be about 13 μm in some embodiments.

FIG. 1B is a schematic diagram showing a cross-sectional side view ofthe exemplary PIFA in FIG. 1A according to some embodiments. The topplate 102 is implemented as a metal layer over the substrate 104, and anisolation layer 112 electrically isolates the top plate 102 from thesubstrate 104. Also, another isolation layer 114 electrically isolatesthe ground plate 106 from the substrate 104. The ground plate 106 isimplemented as a metal layer below the substrate 104 in one example. Thefeed line 108 and ground line 110 are implemented using TSVs through thesubstrate 104. In one example, the substrate 104 is made of silicon(Si). The isolation layers 112 and/or 114 can include dielectricmaterials.

The top plate 102 can be any metal layer among multiple metal layersformed over the substrate 104. Also, the ground plate 106 can be anymetal layer among multiple metal layers formed under the substrate 104.The metal layer may include electrically conductive materials such ascopper, copper alloy, aluminum, aluminum/silicon/copper alloy, titanium,titanium nitride, tantalum, tantalum nitride, tungsten, polysilicon,metal silicide, any combinations thereof, or any other suitablematerial.

The metal layers can be formed by a process including physical vapordeposition (PVD such as PVD by sputtering), chemical vapor deposition(CVD), plating, damascene processes, combinations thereof, or any othersuitable processes. Other manufacturing techniques may includephotolithography processing and etching to pattern the electricallyconductive materials for vertical (via and contact) and horizontalconnects (electrically conductive line). In some embodiments, stillother manufacturing processes such as thermal annealing may be used toform metal silicide to reduce contact resistance. The metal silicideused in multilayer interconnects may include nickel silicide, cobaltsilicide, tungsten silicide, tantalum silicide, titanium silicide,platinum silicide, erbium silicide, palladium silicide, any combinationsthereof, or any other suitable material.

The isolation layers 112 and/or 114 using dielectric materials can be aninterlayer dielectric (ILD) disposed between the substrate 104 and ametal layer, or an inter-metal dielectric (IMD) disposed betweenadjacent metal layers. The dielectric material may include siliconoxide, silicon nitride, silicon oxynitride, spin-on glass (SOG), silicondioxide, fluoride-doped silicate glass (FSG), carbon doped siliconoxide, Black Diamond® (Applied Materials of Santa Clara, Calif.),Xerogel, Aerogel, amorphous fluorinated carbon, Parylene, BCB(bis-benzocyclobutenes), SiLK (Dow Chemical, Midland, Mich.), polyimide,and/or other suitable materials. The dielectric material, in somealternative embodiments, includes a material of a low dielectricconstant (low k) such as a dielectric constant less than about 3.5. Thedielectric material features can be formed by a technique includingspin-on coating, CVD, or any other suitable processes.

The PIFA 100 has a compact size partly due to the high dielectricconstant k of the silicon substrate 104, e.g., about 11.7, compared tosome other material, e.g., about 3.9 of Silicon dioxide (i.e., aslow-wave effect). Applications of the PIFA 100 can be for the mm waveregion, e.g., from 30 GHz to 300 GHz. Because of the compact size (thePIFA 100 length can be smaller than 1 mm), the PIFA 100 can be used,e.g., in mobile applications. The PIFA 100 can provide a half-wavelengthand a quarter-wavelength radiation in some embodiments as describedbelow in FIG. 2.

The ground line 110 can be located close to an edge of the top plate 102in some embodiments. In other embodiments, the ground line 110 can belocated close to the center of the top plate 102. This has the effect ofextending the top plate 102 beyond a ground line 110 previously locatedat an edge of the top plate 102, and allow the antenna to radiate atboth a half-wavelength and a quarter-wavelength.

The PIFA 100 using a TSV through the substrate 104 has less parasiticelements (e.g., inductance or capacitance), compared to a PIFAimplemented all above the substrate 104. The TSV structure not onlyprovides a connection through the substrate 104, but also provides apart of the PIFA 100, e.g., the feed line 108 and the ground line 110.Thus, the fabrication of PIFA 100 can be integrated with a ComplementaryMetal-Oxide-Semiconductor (CMOS) process flow. Further, a die to dietransmission is possible using a 3-dimensional (3D) stack packaging thatcan feed a signal through the feed line (TSV) 108 instead of abond-wire. In other embodiments, micro bond-wire can be used to couplethe feed line (TSV) 108 to another die, e.g., for the 3D packaging.

For the PIFA 100, the substrate 104 is floating, and the ground plate106 is farther away from the top plate 102 (e.g., about 100 μm in someembodiments due to the thickness of the substrate 104). A radiofrequency (RF) wave signal can be radiated more easily, compared to aPIFA having only 2-3 μm separation between the ground plate 106 and thetop plate 102.

FIG. 2 is a plot showing a return loss performance of the exemplary PIFAin FIG. 1A according to some embodiments. The return loss (S11parameter) plot 202 of the PIFA 100 in FIG. 1A shows a half-wavelengthfrequency at about 34 GHz, and a quarter-wavelength frequency at 80 GHz.The exemplary PIFA 100 have a size of 530 μm×530 μm and the siliconsubstrate had a dielectric constant of about 11.9 with a return loss ofabout −25 dB at 80 GHz. In contrast, an exemplary PIFA implemented on aPCB has a size of 853 μm×853 μm with a return loss of only about −7 dB.Thus, the exemplary PIFA 100 has a more compact size and better returnloss performance.

FIG. 3A-FIG. 3D are schematic diagrams showing top views of differentimplementations of the exemplary PIFA in FIG. 1A according to someembodiments. The frequency and return loss performance can be changed bydifferent shapes of the top plate 102 and different locations of thefeed line 108 and the ground line 110, which can be verified using asimulation tool.

FIG. 3A is a top view of an exemplary PIFA having a spiral or meandershape. The top plate 102 can have an extension 302 for a meander shapeor an extension 304 for a spiral shape. The feed line 108 and groundline 110 are also shown. The meander and/or spiral shape can be used fora compact size antenna. The spiral shape can be even smaller than themeander shape, but the directivity is stronger than the meander shape.For applications that require radiation in a particular direction andwith a very compact size, the spiral shape can be used.

FIG. 3B is a top view of an exemplary PIFA having a folded shape. Thetop plate 102, the feed line 108, and ground line 110 are shown. Thefolded shape can be also used for a compact size. The folded shapeallows the main part of the top plate 102 to be some distance away fromthe feed line 108 and the ground line 110 for better performance.However, since the routing area is getting larger, it may not bepreferred for higher frequency applications or for a more compact size.

FIG. 3C is a top view of an exemplary PIFA having a spiral shape. Thelocations of the feed line 108 and ground line 110 are different fromthe PIFA in FIG. 3A. The extended top plate 306 beyond the ground line110 and a different feed line 108 location result in different couplingbetween the feed line 108 and the ground line 110 and can be used forfine-tuning the performance of the spiral shape and/or meander shape ofFIG. 3A.

FIG. 3D is a top view of an exemplary PIFA having a slotted top plate102. The shape of the slots 308 are not limited to the shape in FIG. 3D.The slots 308 change the current distribution in the top plate 102 andfacilitates to produce another bandwidth, e.g., for a dual bandapplication. This type could be used for shunt metal layers, e.g., metallayers 1 and 2, metal layers 2 and 3, or metal layers 1, 2, and 3, toreduce the impedance of the antenna, which might impact the performance.

In addition, more than one feed line 108 and/or more than one groundline 110 can be used in some embodiments. The top plate 102 and/orground plate 106 can be implemented on more than one metal layer in someembodiments. In some applications, no ground plate 106 is used.

FIG. 4 is a schematic diagram showing a three-dimensional view ofvarious exemplary implementations of the exemplary PIFA in FIG. 1Aaccording to some embodiments. The PIFA 400 includes a feed line 108 andthree ground lines 110 a, 110 b, and 110 c for differentimplementations. The size of the top plate 102 is 530 μm×530 μm. Oneimplementation includes one ground line 110 a at the (x, y) position of(150 μm, 200 μm). Another implementation has another ground line 110 bat (50 μm, 300 μm) in addition to 110 a. Yet another implementationincludes another ground line 110 c at (50 μm, 380 μm), in addition to110 a and 110 b. Varying the ground line (TSV) in numbers and/orlocations changes the performance of the PIFA 400 as described below.

FIG. 5 is a plot showing a return loss performance of the exemplary PIFAin FIG. 4 according to some embodiments. The return loss (S11 parameter)plot 502 of the PIFA having one ground line 110 a has a half-wavelengthfrequency at about 34 GHz, while the return loss plot 504 of the PIFAhaving two ground lines 110 a and 110 b has the frequency at about 43GHz, and the return loss plot 506 of the PIFA having three ground lines110 a, 110 b, and 110 c has the frequency at about 46 GHz. The returnloss values were within about 2.5 dB of each other.

Also, the return loss plot 502 of the PIFA having one ground line 110 ahas a quarter-wavelength frequency at about 80 GHz (about −25 dB), whilethe return loss plot 504 of the PIFA having two ground lines 110 a and110 b has the frequency at about 82 GHz (about −32.5 dB), and the returnloss plot 506 of the PIFA having three ground lines 110 a, 110 b, and110 c has the frequency at about 83 GHz (about −35 dB). FIG. 5 showsthat by varying the number of ground lines (at different locations), thereturn loss and frequency can be changed.

FIG. 6 is a schematic diagram showing a three-dimensional view of yetanother implementation of the exemplary PIFA in FIG. 1A according tosome embodiments. The PIFA 600 has one feed line 108 and an array ofground lines 110. The ground lines 110 (using TSVs) are used to cancelcertain negative current paths on the top plate 102 of PIFA 600. In someembodiments, the PIFA gain can be made larger using more ground lines(using TSVs). An antenna designing/simulation tool can be used to designand/or verify in order to meet certain specifications for the PIFAantenna. An array of feed lines 108 similar to the array of ground lines110 in FIG. 6 can be used, or the ground lines 110 and/or feed lines 108can be arranged in a line in other embodiments. In one embodiment, aminimum layout pitch (e.g., 80 μm) can be used for the ground/feed linearray pitch.

FIG. 7 is a flowchart for designing the exemplary PIFA in FIG. 1Aaccording to some embodiments. At step 702, a shape of the PIFA isselected based on specifications. For example, the available antennaarea for a fabrication process, and available metal layers, etc., can beconsidered for the selection in addition to the characteristics of eachshape as described above for FIG. 3A-FIG. 3D.

At step 704, the PIFA size is determined. For example, a half-wavelengthand/or a quarter-wavelength of the intended signal frequency can becalculated to determine the PIFA size. At step 706, the size of topplate 102 and metal lines, and the location of TSVs are optimized forthe specifications. For example, an antenna design/simulation tool canbe used for this step. At step 708, the performance such as radiationpattern and the return loss (S11) value are checked, e.g., by using anantenna design/simulation tool. At step 710, if the performance meetsthe specifications, the design is finished. If not, go back to step 704to refine the design.

FIG. 8 is a flowchart for implementing the exemplary PIFA in FIG. 1Aaccording to some embodiments. At step 802, a first through-silicon via(TSV) is formed through a substrate for a feed line of the antenna. Atstep 804, a second TSV is formed through the substrate for a ground lineof the antenna. At step 806, a top plate of the antenna is formed overthe substrate, wherein the top plate is electrically conductive andconnected to the first TSV and the second TSV.

In various embodiments, an isolation layer is formed over the substrateprior to forming the top plate. A ground plate of the antenna is formedunder the substrate, wherein the ground plate is electrically conductiveand connected to the second TSV. An isolation layer is formed under thesubstrate prior to forming the ground plate. Another TSV can be formedthrough the substrate for the feed line of the antenna or for the groundline of the antenna. The first TSV is coupled to another die stackedbelow the substrate in a 3-dimensional (3D) packaging.

According to some embodiments, an antenna includes a substrate and a topplate disposed over the substrate. At least one feed line is connectedto the top plate, and each feed line comprises a first through-siliconvia (TSV) structure passing through the substrate. At least one groundline is connected to the top plate, and each ground line comprises asecond TSV structure passing through the substrate. The top plate iselectrically conductive, and the at least one feed line is arranged tocarry a radio frequency signal. The at least one ground line is arrangedto be coupled to a ground.

According to some embodiments, a method of implementing an antennaincludes forming a first through-silicon via (TSV) through a substratefor a feed line of the antenna. A second TSV is formed through thesubstrate for a ground line of the antenna. A top plate of the antennais formed over the substrate, wherein the top plate is electricallyconductive and connected to the first TSV and the second TSV.

A skilled person in the art will appreciate that there can be manyembodiment variations of this disclosure. Although the embodiments andtheir features have been described in detail, it should be understoodthat various changes, substitutions and alterations can be made hereinwithout departing from the spirit and scope of the embodiments.Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, and composition of matter, means, methods and stepsdescribed in the specification. As one of ordinary skill in the art willreadily appreciate from the disclosed embodiments, processes, machines,manufacture, compositions of matter, means, methods, or steps, presentlyexisting or later to be developed, that perform substantially the samefunction or achieve substantially the same result as the correspondingembodiments described herein may be utilized according to the presentdisclosure.

The above method embodiment shows exemplary steps, but they are notnecessarily required to be performed in the order shown. Steps may beadded, replaced, changed order, and/or eliminated as appropriate, inaccordance with the spirit and scope of embodiment of the disclosure.Embodiments that combine different claims and/or different embodimentsare within the scope of the disclosure and will be apparent to thoseskilled in the art after reviewing this disclosure.

What is claimed is:
 1. An antenna comprising: a substrate; a top platedisposed over the substrate; at least one feed line connected to the topplate, each feed line comprising a first through-silicon via (TSV)structure passing through the substrate; and at least one ground lineconnected to the top plate, each ground line comprising a second TSVstructure passing through the substrate, wherein the top plate iselectrically conductive, the at least one feed line is arranged to carrya radio frequency signal, and the at least one ground line is arrangedto be coupled to a ground.
 2. The antenna of claim 1, wherein the topplate comprises multiple metal layers.
 3. The antenna of claim 1,further comprising a ground plate disposed below the substrate, whereinthe ground plate is electrically conductive and coupled to the at leastone ground line.
 4. The antenna of claim 3, wherein the ground platecomprises multiple metal layers.
 5. The antenna of claim 1, wherein theat least one ground line is disposed at an edge of the top plate.
 6. Theantenna of claim 1, wherein the at least one ground line is disposedclose to a center of the top plate.
 7. The antenna of claim 1, whereinthe at least one ground line is arranged in an array or in a line. 8.The antenna of claim 1, wherein the at least one feed line is arrangedin an array or in a line.
 9. The antenna of claim 1, wherein the atleast one feed line is coupled to another die stacked below thesubstrate in a 3-dimensional (3D) packaging using the first TSVstructure.
 10. The antenna of claim 1, wherein the at least one feedline is coupled to another die using a micro bond-wire.
 11. The antennaof claim 1, wherein the top plate has a rectangular shape.
 12. Theantenna of claim 11, wherein the top plate has slots inside therectangular shape.
 13. A method of implementing an antenna comprising:forming a first through-silicon via (TSV) through a substrate for a feedline of the antenna; forming a second TSV through the substrate for aground line of the antenna; and forming a top plate of the antenna overthe substrate, wherein the top plate is electrically conductive andconnected to the first TSV and the second TSV.
 14. The method of claim13, further comprising forming an isolation layer over the substrateprior to forming the top plate.
 15. The method of claim 13, furthercomprising forming a ground plate of the antenna under the substrate,wherein the ground plate is electrically conductive and connected to thesecond TSV.
 16. The method of claim 15, further comprising forming anisolation layer under the substrate prior to forming the ground plate.17. The method of claim 13, further comprising forming a third TSVthrough the substrate for the feed line of the antenna.
 18. The methodof claim 13, further comprising forming a third TSV through thesubstrate for the ground line of the antenna.
 19. The method of claim13, further comprising coupling the first TSV to another die stackedbelow the substrate in a 3-dimensional (3D) packaging.
 20. An antennacomprising: a substrate; a top plate disposed over the substrate; aground plate disposed below the substrate; at least one feed lineconnected to the top plate, each feed line comprising a firstthrough-silicon via (TSV) structure passing through the substrate; andat least one ground line connected to the top plate, each ground linecomprising a second TSV structure passing through the substrate, whereinthe top plate is electrically conductive, the at least one feed line isarranged to carry a radio frequency signal, the at least one feed lineis coupled to another die stacked below the substrate in a 3-dimensional(3D) packaging using the first TSV structure, and the at least oneground line is arranged to be coupled to the ground plate.